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398 RESULTS WITHIN AUSTRALIA
BEST MATCH FOR
ELECTRONICS EQUIPMENT & COMPONENTS


The field of electronics has come a long ways in the last century. Once we used vacuum tubes, but now we typically use solid-state technology. Digital electronics chips have eroded usage of their older analogue counterpart. Computer processors consisted of tens of transistors where today multi-core microprocessors are compact and much more powerful.

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  1. ulti-component force sensors are simple to use and easy to install. High capacities and low profile Multi-axis Load Cells provided by Bestech Australia measure force/load from 0,5kN to 0,250kN along three axes (X,Y,Z) and the corresponding torque.

  2. The LAPP Engineering team have designed an innovative range of nylon cable glands in various sizes and threads to deliver optimum strain relief. The range consists of metric thread to PG thread, plus the click glands that require no locknut.

  3. ELCON micropower connectors provide high current at 12.5A per pin in a contact pitch of 3.0mm and support different currents with multiple combination of different size wire and configuration.

  4. Qorvo QPF7219 Wi-Fi Integrated Front End Modules (iFEMs) are designed for Wi-Fi 6 (802.11ax) systems which combine the advantages of active components with BAW filt

  5. Texas Instruments MSP430FR267x CapTIvate Mixed Signal Microcontrollers (MCUs) are an ultra-low-power MSP430™ microcontroller for capacitive touch sensing for buttons

  6. Analog Devices DC2799A Demo Board for LTC4332 extends an SPI interface with 3 slave devices up to 1200m (150m with a 500kHz SCK as factory configured).

  7. TDK TFM-ALD Thin-Film Metal Magnetic Inductors feature a ±20% tolerance rating, an 85mΩ DC resistance, and 1.0MHz frequency rating.

  8. Newhaven

  9. NXP Semiconductors WCT101XDS Wireless Power Transmitter Controller integrates all required functions for WPC “Qi” compliant wireless power transmitter designs.

  10. Intel Wi-Fi® 6 (Gig+) is based on 802.11ax support for 160MHz channel bandwidth and WPA3.