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Two students win packaging scholarships

24-02-2014
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in 
Two Sydney students have won prestigious AIP scholarships for outstanding packaging design.
 
This is the first time in five years there have been joint winners of the annual AIP Scholarship, awarded to finalists in the 2013 Cormack Innovation Awards.
 
University of Technology Sydney students James Bossi and Justin Chong this year shared the award.
 
Both candidates were excellent examples of the quality of students undertaking design courses in Australia, said Mr Ralph Moyle, National President of the AIP.
 
“James Bossi demonstrated good methodology and thinking throughout the scholarship process, said Mr Moyle. “He displayed a clear interest and involvement in the packaging industry. He understood the importance of recycling and sustainability within packaging design development and has a real interest in solving some of the packaging problems the industry has currently been experiencing.”
 
Justin Chong is experienced in Point of Sale construction and design.
 
“His mechanical skills were part of his in depth answers, said Mr Moyle. “He provided compelling answers to all questions and he was well-spoken and articulate.”
 
Mr Moyle encouraged other schools to nominate students for the Cormack Innovation Awards. 

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