APPMA invites scholarship submissions

01-11-2010

Submissions are open for the third annual APPMA scholarship program to give a packaging engineer an opportunity to complete a Diploma in Packaging Technology.

The Australian Packaging and Processing Machinery Association (APPMA), Australia’s national organisation representing the packaging and processing machinery industry, conducts the scholarship in conjunction with the Australian Institute of Packaging (AIP).

The APPMA will assist a packaging engineer looking to further their education by offering them a scholarship to enrol in the Australian Institute of Packaging Diploma in Packaging Technology.
The Diploma in Packaging Technology is an internationally recognised qualification.

Entries are now available for the APPMA 2011 Scholarship program by emailing info@aipack.com.au or visiting www.aipack.com.au and clicking on the scholarship page. The submission form is also available at: www.appma.com.au

Submissions must be received by Friday, February 18 next year.

The winner will be announced at AUSPACK PLUS to be held at the Melbourne Exhibition & Convention Centre from March 22-25.

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